With the rapid development of smartphones and the rapid changes in market demand, the screen size of smartphones is getting larger, the bezels are getting narrower, and the reliability requirements are getting higher and higher. International smartphone manufacturers have turned to reactive hot melt Glue (PUR) solution. Reactive hot melt adhesive (PUR) has the characteristics of fast curing and ultra-high strength, which can adapt to the rhythm of efficient automated production, while providing very high strength in a limited area, improving the overall impact resistance, sealing and reliability.
